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As reported on DailyTech, AMD is talking about developments that will lead first to six-core processors, followed by a twin-die package that will put 12 cores in a socket:
"A twin-die Istanbul processor could enable 12 cores in a single package. Each of these cores will communicate to each other via the now-enabled HT3.0 interconnect on the processor."
Tip of the hat to Inside HPC for finding this story. Full Story
Posted by Rich Brueckner [root] ( April 21, 2008 03:27 PM ) PermalinkComments:
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