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Monday March 24, 2008 
• New Sun Technology in the NY Times 
John Markoff has an article in today's New York Times about some new techology coming out of Sun Labs that uses lasers to connect chips rather than wires.
"Sun Microsystems
is trying to do for computing what all the king’s horses and men failed
to do for Humpty Dumpty. For decades, the semiconductor industry has
broken silicon wafers into smaller chips to improve manufacturing
yields."
( Mar 24 2008, 08:19:47 AM PDT )
[News]
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